• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
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  • 法律状态
  • 优先权
    • 专利摘要:
    A method is described for equipping a component carrier (130) with electronic components (290). The method comprises (a) introducing the component carrier (130) into an assembly area (108) of a placement machine (100); (b) fixing the device carrier (130) in the placement area (108) such that the device carrier (130) takes a fixed spatial position with respect to the placement machine (100); (c) detecting a mark (132-232a) attached to the component carrier (130); (d) determining the position of the detected mark (132-232a) in a coordinate system of the placement machine (100); (e) loading the device carrier (130) with a first plurality of devices (290) in consideration of the determined position; (f) re-detecting the mark (132 232a); (g) redetermining the position of the re-detected mark (132 232a) in the coordinate system; and {h) populating the device carrier (130) with a second plurality of devices taking into account the re-determined position. It 'also describes a placement machine (100) and a computer program, by means of which the method can be performed for loading.
    公开号:AT517157A2
    申请号:T205/2016
    申请日:2016-04-20
    公开日:2016-11-15
    发明作者:Christoph Gruber；Leif Reichert；Sylvester Demmel；Boris Bürdek
    申请人:Asm Assembly Sys Gmbh & Co Kg；
    IPC主号:
    专利说明:

    Technical area
    The present invention relates generally to the technical field of assembly technology. In particular, the present invention relates to the sensor technology in a placement machine and in particular the detection of measurement data by means of a sensor and the processing of the measurement data by a data processing device which is connected downstream of the at least one sensor to ensure a spatially precise assembly of component carriers with electronic components , In particular, the present invention relates to a method, a placement machine and a computer program for populating a component carrier with electronic components, wherein the component carrier, taking into account certain position data of at least one mark, which is attached to the component carrier, is fitted.
    Background of the invention
    The automatic assembly of component carriers is usually carried out in so-called. Placement machines. In this case, electronic components are transported from a component feed device to a placement position and placed on the component carrier each at a designated component slot. Due to the increasing miniaturization of electronic components, a correct placement process is based on a precise position determination both of the component to be mounted and of the component carrier to be loaded.
    The orientation of a component carrier introduced into a placement area of a placement machine and to be loaded is typically carried out by means of markings which are applied to the component carrier and are optically detected by a camera. A data processing device connected downstream of the camera then ensures the desired position or position determination of the component carrier relative to a stationary coordinate system of the placement machine. In contrast to another camera, which is determined in a known manner for a position determination of aufzusetzenden electronic components and is therefore also referred to as a component camera, the particular for determining the position of the component carrier to be equipped camera is referred to as printed circuit board camera.
    On a component carrier to be loaded, either a single (larger) electronic module or several (smaller) separate electronic modules can be constructed. In the construction of multiple (small) electronic assemblies, the entire component carrier is typically divided into a plurality of so-called sub-panels. In this case, for the purpose of highly accurate position determination, each subpanel can be assigned a marking or a plurality of markings.
    After the introduction of a component carrier to be loaded into a placement area of a placement machine, typically by means of a
    Transport system, the component carrier is fixed spatially by means of a clamp. Immediately after this spatial fixation applied to the component carrier markers are measured and determines the exact spatial position of the component carrier within the placement area.
    The duration of the actual placement process depends on the number of components which are to be placed on the component carrier to be equipped or on the majority of sub-panels formed on the component carrier.
    In the placement area of a placement machine, there is typically a somewhat elevated temperature compared to the ambient conditions. This can be caused, for example, by the waste heat from engines which are used for positioning a placement head of the placement machine. However, the increased temperature has the consequence that a component carrier to be assembled heats up slowly during its assembly. In the case of small placement contents, i. comparatively few electronic components are placed on the component carrier, this slow temperature increase plays only a minor role. For larger Bestückinhalten, which require a longer residence time of the component carrier to be loaded in the Bestückbereich, however, there is no longer negligible in today's placement accuracy continuous thermal expansion of the component carrier during its assembly. As a result, the initially measured or fixed spatial coordinate system of the component carrier is distorted and the placement accuracy correspondingly reduced.
    In the case of a realistic temperature increase of 7K, for example, for a 500 mm long component carrier taking into account the thermal expansion coefficients of copper (16.5 × 10 -6 K'1), a maximum displacement of the mounting position of 58 μm (58 × 10 ') results. 6m.) Such a positional shift can lead to a faulty assembly, in particular for small components or for components with a plurality of terminal contacts that are slightly spaced apart from one another (for example so-called fine-pitch components).
    Although this problem is known per se, a reduction in placement accuracy caused by a temperature increase of the component carrier to be populated is accepted. There are only a few measures known with which the reduction of placement accuracy can be kept within limits. (A) Thus, for example, in the case of a distribution of the assembly onto several placement machines, it can be attempted that the placement content, which is assigned to a placement area of a placement machine, is relatively small. As a result, the residence time of a component carrier to be loaded in the placement area is reduced. Depending on the respective placement task and the available number of placement machines such a division is not always possible and / or it must be taken a significant reduction in Bestückleistung in purchasing. In this context, the term "placement performance" is to be understood as the number of electronic components which can be set up within a predetermined time unit by a placement head of a placement machine. (B) Furthermore, the temperature increase of a component carrier can be reduced by the fact that in the placement area In order to ensure good thermal contact between such a holding device and the component carrier, it can be sucked onto the surface of the holding device, for example by means of a negative pressure, but such a cooled or coolable holding device is technically comparatively expensive Consequently, such a fixture will not be able to accommodate all possible types of device carriers. (C) When equipping a component carrier with a plurality of mutually independent electronic assemblies, which are each constructed on a sub-panel, it is conceivable to carry out a measurement of a respective sub-panel permanently associated respectively immediately before the placement of such a sub-panel , However, this can only be successful if the number of electronic components which are to be placed on a sub-panel is comparatively small. Only in this case, namely, the Bestückdauer the corresponding sub-panel will be small. (D) Further, it is known to form a plurality of local markers on the component carrier to be loaded, which are each associated with a relatively small number of electronic components. If the respective mark (s) is or will be measured as directly as possible before the equipping of said relatively small number of components, the effective placement time (by a corresponding reduction in the number of components to be equipped, which is to be measured) is also measured here are assigned) reduced. However, such a measure significantly worsens the placement of a placement and makes an operation of a placement machine cumbersome.
    The invention has for its object to improve the accuracy of the assembly of component carriers with electronic components in a placement area of a placement in a simple way.
    Summary of the invention
    This object is solved by the subject matters of the independent claims. Advantageous embodiments of the present invention are described in the dependent claims.
    According to a first aspect of the invention, a method for populating a component carrier with electronic components is described. The method comprises (a) introducing the component carrier into a placement region of a placement machine; (b) fixing the component carrier in the placement area such that the component carrier assumes a fixed spatial position with respect to the placement machine; (c) detecting a mark attached to the component carrier; (d) determining the position of the detected mark in a coordinate system of the placement machine; (e) loading the device carrier with a first plurality of devices taking into account the determined position; (f) re-detecting the mark; (g) redetermining the position of the re-detected mark in the coordinate system; and (h) populating the device carrier with a second plurality of devices taking into account the re-determined position;
    The method described is based on the finding that the process of equipping a component carrier with a multiplicity of electronic components is temporarily interrupted and that a renewed positional change occurs in the resulting assembly-free period of time.
    Measuring the one formed on the device carrier mark can be made. As a result of this renewed position measurement, a slight shift of placement positions on the component carrier caused in particular by a typically unwanted thermal expansion of the component carrier can be detected and compensated for by a suitable control of a positioning system for a placement head. Thus, a high placement accuracy can be ensured without additional hardware components for a placement despite spite of particular thermally induced distortion of the component carrier.
    In comparison to known measures for determining or compensating for a particular thermally induced distortion of a component carrier, in which only the number of markers used is increased, a completely different approach is pursued with the invention described here. Namely, the approach according to the invention does not start from an increase in the number of markings and thus a reduction in the number of components to be equipped, which are each associated with a marking. Rather, by a cyclic measurement of at least one mark applied to the component carrier, its positional shift is detected as a function of time, and conclusions are obtained therefrom about a delay of the component carrier that is variable with time. This time-dependent delay of the component carrier is then compensated by a suitable control of a positioning system, with which a placement is moved relative to the component carrier to be loaded.
    The term "component carrier" can be understood in this document to mean any type of substrate capable of mounting, in particular a printed circuit board. A component carrier may be more or less rigid or even flexible. A component carrier may further comprise both rigid and flexible regions.
    In this document, the term "component" can be understood to mean all equippable elements which can be placed on a component carrier. Components may in particular be two-pole or multi-pole SMT components or other highly integrated planar components such as ball grid arrays, bare dies and flip chips. Furthermore, the term "component" may also include mechanical elements such as, for example, pins, plugs, sockets or the like, or optoelectronic components such as light-emitting diodes or photodiodes. In addition, the term "component" may also include so-called RFID chips, which are used for so-called transponders.
    The term "placement area" can be understood in particular to mean a spatial part of a placement machine in which the component carriers are located during their placement. Depending on the design of the placement machine involved, the placement area may be in the center, in an edge area or even outside the placement machine.
    The described fixing of the component carrier is preferably carried out in a detachable manner. This means that the fixation of the component carrier in the placement area can be achieved after at least partial assembly, so that this component carrier can be removed from the placement area and a new component carrier to be loaded can be introduced in the placement area. Both for introducing and for removing the component carrier, a preferably linear transport system can be used, by means of which component carrier can be driven sequentially through the placement area. Of course, a "stopover" is inserted into the placement area, so that the electronic components are placed on a stationary and not on a moving component carrier.
    According to one exemplary embodiment of the invention, the detection of the marking and / or the re-detection of the marking takes place optically by means of a camera. This has the advantage that, for carrying out the method described here, markings can be used which are already used in a known manner in the case of what is known as a first position determination of a building-material carrier to be loaded. Furthermore, the optical detection can be carried out with a measuring device which is present in many known placement machines. The method described thus requires no special components and can be controlled by a software that is installed, for example, as part of an update to a control computer of a placement. Thus, a known placement machine can be easily configured so that the method described here can be performed.
    According to a further exemplary embodiment of the invention, the camera is a camera which can be moved in the coordinate system of the placement machine. It is therefore advantageously not necessary that when using multiple markers, the camera detects these multiple markers in a single camera image. Rather, the camera can possibly be moved in the coordinate system of the placement so that the respective mark is detected at a position of the camera, which is located immediately above the mark in question. As a result, the accuracy of the optical detection can be improved at least if, during the detection of the corresponding marking, the position of the camera in the coordinate system of the placement machine is precisely known.
    The camera can preferably be moved by means of a positioning system, which is also responsible for a method or positioning of a placement head, from which components are picked up by a component feeder, transported to the placement area and placed on the component carrier located in the placement area.
    In a particularly simple embodiment, the movable camera is attached directly or indirectly to the placement head. In this context, it should be noted that the use of a placement system associated with the placement of a method of the camera does not or at least only slightly insignificant leads to unwanted idle times in the assembly, since during the re-capture of the at least one mark the placement of the component carrier temporarily interrupted anyway must become.
    According to a further embodiment of the invention, wherein the marking is detected together with a structural element of the placement, which has a fixed spatial position in the coordinate system of the placement. Illustratively, the described structural element serves as a reference structure which has a precisely defined position in the coordinate system of the placement machine. In that case, it suffices merely to determine the relative position of the detected mark with respect to the structural element. Knowing the exact position of the structural element, the absolute position of the detected mark in the coordinate system can be determined with high accuracy based on the determined relative position.
    According to another embodiment of the invention, the method further comprises (i) re-detecting the tag; (j) redetermining the position of the re-detected mark in the coordinate system; and (k) populating the device carrier with a third plurality of devices taking into account the re-determined position.
    The described redetermining of the position of the marking has the advantage that position changes and / or distortions of the component carrier to be loaded can be determined repeatedly and compensated for by a suitable control with respect to a positioning of the placement head. This is particularly advantageous when the BaueJementeträger located in the Bestückbereich is to be equipped with a variety of components, which naturally leads to a comparatively long assembly time and thus typically also to larger particular thermal distortion or positional displacements of the component carrier.
    In this context, it should be noted that the method described in this document can also have a multiplicity-in principle infinitely-of cycles, one cycle of detecting the mark, determining the position of the detected mark, and equipping the component carrier with one Comprises a plurality of components taking into account the last determined position of the marking. The repetition rate or the duration of such a cycle can be selected preferably depending on the respective operating conditions and in particular on the strength or the temporal gradient of an expected delay or an expected positional shift of the component carrier to be loaded.
    According to another embodiment of the invention, the method further comprises (a) detecting at least one further mark attached to the device carrier; (B) determining the position of the detected further mark in the coordinate system, wherein in the assembly of the component carrier with the first plurality of components, the specific position of the detected further mark is taken into account; (c) re-detecting the further label; and (d) redetermining the position of the re-detected further mark in the coordinate system, wherein the re-determined position of the detected further mark is taken into account when the component carrier is loaded with the second plurality of components.
    As a result of the repeated position measurement of at least one further marking also formed on the component carrier, a particularly thermally induced distortion of the component carrier can be recognized with particularly high accuracy and taken into account when equipping the component carrier with the second plurality of components in a suitable manner.
    Preferably, the (first) mark is located in the region of a first end of the device carrier and the further mark is in the region of an opposite other end of the device carrier. Position shifts of individual points of the component carrier can be determined by a suitable interpolation between the position shift of the (first) mark and the position shift of the further mark. The position shift of the (first) marking can also be zero. This happens, for example, when the (first) marking is at least approximately in that part of the component carrier, which is fixed in the exact position within the placement machine. Such a positionally accurate fixation can be achieved in a known manner by a suitable clamping of Baueiementeträgers particular on a component carrier transport system.
    In this context, it is easy to see that a particularly thermally induced distortion of the component carrier can be determined more accurately, the higher the number of markers whose positional shift is detected and taken into account in the assembly of the second plurality of components.
    Thus, for example, when using three markings, a distortion of the component carrier determined by a shear effect can also be detected.
    According to a further exemplary embodiment of the invention, (a) the marking is assigned to a first subregion of the component carrier, and (b) the further marking is assigned to a second subregion of the component carrier. The first subregion is different from the second subregion.
    The sizes as well as the spatial positions of the various subregions or the positions of the two markings can be suitably selected depending on the placement content. As a result, position shifts of individual parts of the component carrier can be determined with a particularly high accuracy even with a relatively small number of markings, which position shifts are particularly relevant for the respective placement content.
    In this context, in particular, the first plurality of components may be assigned to the first subregion of the component carrier, and the second plurality of components may be assigned to the second subregion of the component carrier.
    According to a further embodiment of the invention, the method further comprises monitoring a measured variable which is indicative of an operating condition for the process of assembling the
    Component carrier with the first plurality of components. In this case, the re-detection of the marking as well as the re-determination of the position of the re-detected marking in the coordinate system is performed when the current value of the monitored measured variable has exceeded or at least reached a predetermined threshold.
    The monitored measurand may be any physical observable associated with the first part of the placement process specified by the method described herein. The first part of this placement process comprises all method steps which are carried out until the component carrier is loaded with the first plurality of components. In particular, the monitored measured variable may be characteristic of the course or the possibly changing with time operating conditions under which the first plurality of components are placed on the component carrier.
    According to a further exemplary embodiment of the invention, the monitored measured variable is a current time span between a start time and a current time. The start time is predetermined by the procedure of the method up to the loading of the component carrier with the first plurality of components. The predetermined threshold is a predetermined period of time. The predetermined period thus determines the time at which the re-detection of the mark and the re-determination of the position of the mark is performed.
    It should be noted that the principle of taking into account a predetermined period described with this embodiment can be applied not only for the re-detection of the mark as well as for the re-determination of the position of the re-detected mark. This principle can also be applied to at least one further cycle of the assembly process in the case of a loading process with more than two of the cycles described above.
    The predetermined period of time can also be understood as the expiration time within which a previously determined position of the marking is considered valid. Preferably, all said times or periods can be assigned to a system time of a placement machine or determined taking into account this system time.
    According to a further embodiment of the invention, the start time is determined by detecting the mark.
    To put it simply, the time of detection of the marking represents a time zero, to which, of course, a slowly occurring positional shift or a slowly occurring distortion of the component carrier is not yet present. By this choice of the time zero point, a particularly high average placement accuracy can be achieved. In this context, the term "average placement accuracy" is understood to mean the placement accuracy averaged over all the components of the relevant plurality of components, wherein this placement accuracy is typically greater for components which are placed shortly after the zero time point for the components, which at one time be placed on the component carrier, which time is well after the time zero.
    According to a further exemplary embodiment of the invention, the monitored measured variable is the temperature present in the placement region. Thus, exactly that physical measured variable is determined which directly has an influence on thermally induced positional shifts or on thermally induced distortions of the component carrier.
    The temperature can be effected by means of a suitable temperature sensor, which is located in the placement area. The closer the temperature sensor is arranged to the component carrier to be assembled, the more accurately the relevant temperature for the method described is detected. It is even possible that such a temperature sensor is thermally coupled directly to the component carrier to be loaded. However, such an embodiment, which requires some operational effort, probably allows the highest accuracy of the method described herein.
    According to a further embodiment of the invention, the threshold value is a predetermined temperature or a predetermined temperature change which has set since the detection of the marking.
    The described threshold value can be chosen such that the mounting of the component carrier with electronic components can be continued too long until the temperature drift is so great that a predetermined placement accuracy can no longer be guaranteed. If this threshold is reached, then according to the embodiment of the invention described here, the assembly of the component carrier is briefly interrupted and made the above-described repositioning of a mark. If the positional displacement of the marking caused by the temperature drift is taken into account in the subsequent assembly of the component carrier, then thermally induced distortions of the component carrier are automatically compensated.
    In this context, it should be mentioned that a drift in the temperature of a component carrier to be populated and a concomitant spatial distortion of the component carrier in practice is typically a very slow process which has a negative continuously increasing influence on the placement accuracy. The inventive "re-calibration" during the placement of a plurality of electronic components, which is carried out after the placement of the first plurality of electronic components, a persistently high placement accuracy can be ensured for a variety of electronic components in a comparably simple manner.
    It should be noted that the time for such a "re-calibration" can also be determined by monitoring two or more assembly-specific measured variables, said time being determined by the more critical for the placement accuracy measurement or by a combination of at least two components or assembly-specific measured variables can be determined. This also applies to the further (physical) measured variables described below by way of example.
    According to a further exemplary embodiment of the invention, the monitored measured variable is an amount of heat which is emitted into and / or to the placement area of components of the placement machine and in particular of electromechanical components of the placement machine.
    Illustratively, here the placement machine and in particular the placement area of the placement machine is regarded as a thermal system which shows a certain increase in temperature in response to an amount of heat given off to the system. The relationship between the amount of heat released and a resulting increase in temperature can be determined experimentally beforehand and stored, for example, in a lookup table.
    The major part of the amount of heat emitted originates from electromechanical components and in particular motor drives, which are assigned to a positioning system and required to position the placement head in a suitable manner. In addition, a significant amount of heat can also be generated by electromechanical actuators, which are assigned to the relevant placement head.
    The amount of heat released may possibly be determined without an additional or special sensor by simply detecting electrical quantities such as voltage and / or current which are required for the operation of an electromechanical component (eg motor drive, actuator) and from this the determined by the relevant electromechanical component amount of heat is determined.
    According to a further exemplary embodiment of the invention, the monitored measured variable is the number of components which have been placed on the component carrier since the position of the marking was previously determined.
    By taking into account the number of mounted on the component carrier components can be determined in a particularly simple manner, an approximate amount of heat, which is generated by the above-mentioned electromechanical components. It is assumed to a good approximation that any mechanical movement which is required for (a) receiving an electronic component, in particular from a component feeder, (b) transporting the recorded component in the placement area and (c) placing the Component on the component carrier, on average produces a certain amount of heat, which leads to an increase in temperature of the component carrier to be equipped. Again, if necessary, the relationship between (i) the temperature increase of
    Component carrier and (ii) the number of aufzusetzenden on the component carrier electronic components are determined in advance and deposited in a lookup table.
    According to a further aspect of the invention, a placement machine for equipping a component carrier with electronic components is described. The placement machine described has (a) a placement area for receiving the component carrier; (b) a camera for measuring at least one marker attached to the component carrier; (c) a placement head (cl) for receiving at least one electronic component, (c2) for transporting the at least one received electronic component via the component carrier and (c3) for mounting the at least one transported electronic component on the component carrier; and (d) a data processing device coupled to the camera, wherein the data processing device is set up to cause the placement machine to carry out the method described above.
    According to a further aspect of the invention, a computer program for populating a component carrier with electronic components is described. The computer program, when executed by a data processing device, is arranged to perform the method described above.
    For the purposes of this document, the mention of such a computer program is synonymous with the notion of a program element, a computer program product, and / or a computer readable medium containing instructions for controlling a computer system to appropriately coordinate the operation of a system or method to achieve the effects associated with the method of the invention.
    The computer program may be implemented as a computer-readable instruction code in any suitable programming language such as JAVA, C ++, etc. The computer program can be stored on a computer-readable storage medium (CD-ROM, DVD, Blue-ray disk, removable drive, volatile or non-volatile memory, built-in memory / processor, etc.). The instruction code may program a computer or other programmable device to perform the desired functions. Further, the computer program may be provided in a network, such as the Internet, from where it is downloaded by a user as needed.
    The invention can be implemented both by means of a computer program, i. software, as well as by means of one or more special electronic circuits, i. in hardware or in any hybrid form, i. using software components and hardware components.
    It should be noted that embodiments of the invention have been described with reference to different subject matters. In particular, some embodiments of the invention are described with method claims and other embodiments of the invention with apparatus claims. However, it will be readily apparent to those skilled in the art upon reading this application that, unless explicitly stated otherwise, in addition to a combination of features belonging to a type of subject matter, any combination of features that may result in different types of features is also possible Subject matters belong.
    Further advantages and features of the present invention will become apparent from the following exemplary description of presently preferred embodiments.
    Short description of the drawing
    Figure 1 shows a perspective view of a placement according to an embodiment of the invention.
    FIG. 2 shows a component carrier with a plurality of markings and a sub-area in which a plurality of slots are located, with an electronic component already occupied by an already partially loaded component carrier.
    FIG. 3 shows a flow chart of a placement method according to a preferred embodiment of the invention.
    Detailed description
    It should be noted that the embodiments described below represent only a limited selection of possible embodiments of the invention.
    FIG. 1 shows a placement machine 100 which has a frame 102 on which two parallel aligned guides 103 are mounted. The two guides 103 carry a transverse support arm 104. The transverse support arm 104 has a guide 105 on which a support member 106 is slidably mounted. In a Cartesian coordinate system used in FIG. 1, the two guides 103 extend along a y-direction, the guide 105 runs along an x-direction. Arranged on the carrier element 106 is a placement head 107 which has at least one component holding device embodied as a suction pipette 120, which can be displaced by means of a drive (not shown) along a z-direction which is perpendicular to the x-direction and the y-direction.
    In order to correct the angular position of recorded components and thus to equip the components with a correct angular position, an unillustrated rotary drive is also provided. By means of the rotary drive, the suction pipette 120 can be rotated about its longitudinal axis.
    The placement machine 100 also has a component feed device 112, via which components not shown in FIG. 1 can be supplied to the placement process. Furthermore, the placement machine 100 has a conveyor belt 131, with which a component carrier to be equipped or a circuit board 130 to be equipped can be introduced into a placement area 108 of the placement machine 100. The suction pipette 120 can be positioned within the placement area 108 by a corresponding x-y movement of the placement head 107.
    The placement machine 100 also has a processor or a central control unit 101. On the control unit 101, a machining program for the placement machine 100 for equipping ßauelementeträgem 130 can be performed with components, so that all components of the placement machine 100 work in a synchronized manner and thus contribute to a faultless and rapid loading of component carriers 130 with components.
    In addition, a so-called printed circuit board camera 114, which is provided for detecting a marking 132 attached to the component carrier 130, is fastened to the carrier element 106. In this way, the exact position of a placed in the placement area device carrier 130 can be determined by a position measurement of the marker 132. According to an embodiment of the invention described below, a position determination of the marking 132 takes place at least twice during the assembly of the component carrier 130. Further details will be described below.
    For position measurement and for the control of recorded components, a camera 116 is provided, which is arranged according to the embodiment shown here in a fixed position on the placement machine 100. The optical component measurement preferably takes place immediately after the component has been received by the component supply device 112 by a corresponding positioning of the placement head 107 above the component camera 116. The image recorded by the camera 116 is evaluated in a data processing device 118. In this case, both a detection of the recorded component type and a position determination of the recorded component is performed. When determining the position, the offset of the component picked up by the suction pipette 120 relative to the suction pipette 120 or relative to the placement head 107 is determined.
    The data processing device 118 can also be integrated in the central control unit 101. In this case, the data processing device 118 can be realized by means of its own hardware or also by means of suitable software.
    It should be noted that the invention is by no means limited to use in the placement machine 100 shown here. The invention can in particular also be realized with a component camera which is moved together with the placement head 108 and which is provided for measuring the recorded components during transport from the receiving position to the placement position.
    Likewise, the invention can be used in connection with a so-called. Multiple placement head, which has a plurality of holding devices and thus can simultaneously transport a plurality of components. In this case, the holding devices can be arranged in rows or in a matrix. Likewise, the holding devices can, however, also be arranged so that they are radially projecting about an axis of rotation, so that a plurality of components can be picked up sequentially by a rotation of the holding devices and also set down again. Of course, however, the invention can also be implemented with any other types of single or multiple placement heads.
    FIG. 2 shows a component carrier 130 with a plurality of markings 232a, 232b, 232c and 232d, which are attached to an upper side of the component carrier 130. As already described above with reference to FIG. 1, the positions of these markings 232a, 232b, 232c, 232d immediately before a first partial loading of the component carrier 130 with a first plurality of electronic components 290 and immediately before a second partial assembly (and after the first partial assembly of the Device carrier 130 measured with a second plurality of electronic components.
    The spatially not quite regular arrangement of the markings 232a, 232b, 232c and 232d is intended to illustrate a certain spatial distortion of the component carrier 130, which occurred during the previous partial assembly of the component carrier 130 with electronic components 290 due to an increase in temperature in the placement region shown in FIG is. Each marker 232a, 232b, 232c, 232d may be assigned a positional shift dx along an x-direction and a positional shift dy along a y-direction. The positional displacements of the markings 232a, 232b, 232c, 232d may be interpolated appropriately so that individual positional displacements dx and dy can be determined over the entire area of the component carrier 130 for each possible placement location. These for each placement individual position shifts dx, dy can then be compensated by a suitable modified positioning of the placement when placing the corresponding electronic components.
    The component carrier 130 shown in FIG. 2 has a lower region 235, in which there are a plurality of bays 236 for each electronic component. As illustrated in FIG. 2, a first part of the slots 236 is already laid with the first plurality of electronic components 290. The remainder of the slots 236, which are illustrated with an open rectangle, are to be equipped with a second plurality of electronic components and possibly with a further plurality of electronic components. According to the exemplary embodiment shown here, after each of these "multiples" and immediately before the further placement of the sub-area 235, the positions of the markings 232a, 232b, 232c and 232d are re-measured.
    It should be noted that further subregions of the component carrier 130 not shown in FIG. 2 can be equipped in the same way.
    FIG. 3 shows a flow chart of a placement method according to a preferred embodiment of the invention. The placement process begins with a step S1 in which a component carrier to be loaded is introduced into the placement area 108 of the placement machine 100 shown in FIG. For this purpose, a transport system with a conveyor belt 131 (see FIG. 1) is used, on which the component carrier to be assembled rests. Arrived in the placement area of the component carrier is mechanically fixed in a step S2, so that the component carrier during the subsequent assembly in relation to a fixed spatial coordinate system of the placement machine can not move.
    After the fixation of the component carrier, the markings 232a, 232b, 232c and 232d shown in FIG. 2 are measured in a step S3 by means of a camera mounted on a placement head. Thereafter, in a step S4, the positions of the marks 232a, 232b, 232c and 232d are determined in a fixed coordinate system of the placement machine.
    This is followed, in a step S5, by loading of the component carrier with the first plurality of components. During this (part) assembly, a physical measurand is continuously monitored which is indicative of the operating conditions of the corresponding (part) placement process. According to the embodiment shown here, this operating condition is the current time which has passed since the detection of the marks in step S3. This continuous monitoring is done by means of a query Fl. If the current time span is still shorter than a predefined time period SW, then the loading of the component carrier is continued in step S5. If the current period of time be greater than or at least equal to the predetermined time SW, then the loading of the electronic component carrier is interrupted. During this interruption, the markings are detected again in a step S6 and the positions of the markings are determined again in a step S7. Based on the re-determined positions then the assembly of the component carrier is continued with the second plurality of electronic components. In this case, a certain delay of the component carrier is determined based on the re-determined positions for each placement position. This delay is compensated by a suitable modified positioning of the placement when placing the corresponding component. During this second (partial) assembly with the second plurality of components, it is checked by means of a query F2 whether the assembly of the component carrier has been completed or whether additional components are to be placed or placed on the component carrier.
    If the query F2 shows that even more components must be placed, then the placement method described here is continued with the above-described step S5. Depending on the number of electronic components still to be placed or on the time required for this purpose, the sequence comprising the query F1, the steps S6, S7 and S8 and the query F2 is performed once more or even several times.
    If the inquiry F2 reveals that at least the relevant subarea of the component carrier has already been completely filled, then in a step S10 the mechanical fixation of the component carrier in the placement area is released and in a step S11 the component carrier is moved up out of the placement area by means of the transport system.
    The repeated positioning of markings applied to a component carrier described in this document allows the placement accuracy to be increased in a simple manner. This applies in particular to placement contents which comprise a plurality of electronic components whose placement on a component carrier requires a correspondingly long time, so that comparatively large spatial distortions of the component carrier can occur.
    It should be noted that the term "comprising" does not exclude other elements and that the "on" does not exclude a plurality. Also, elements described in connection with different embodiments may be combined. It should also be noted that reference signs in the claims should not be construed as limiting the scope of the claims. Reference numbers: 100 Placement machines 101 Control unit 102 Frame 103 Guides 104 Carrier arm 105 Guide 106 Carrier element 107 Placement head 108 Placement area 112 Component feed device 114 Circuit board camera 116 Component camera 118 Data processing device 120 Suction pipette 130 Component carrier 131 Conveyor 132 Marking 235 Subrange 232a-d Markings 236 Places for electronic components 290 electronic components
    权利要求:
    Claims (16)
    [1]
    claims
    A method of assembling a component carrier (130) with electronic components (290), the method comprising inserting the component carrier (130) into a placement region (108) of a placement machine (100); Fixing the component carrier (130) in the placement area (108) so that the component carrier (130) assumes a fixed spatial position with respect to the placement machine (100); Detecting a mark (132-232a) attached to the component carrier (130); Determining the position of the detected mark (132-232a) in a coordinate system of the placement machine (100); Populating the component carrier (130) with a first plurality of components (290) taking into account the determined position; re-detecting the mark (132 232a); redetermining the position of the re-detected mark (132 232a) in the coordinate system; and populating the device carrier (130) with a second plurality of devices taking into account the re-determined position.
    [2]
    2. Method according to the preceding claim, wherein the detection of the marking (132 232a) and / or the re-detection of the marking (132 232a) takes place optically by means of a camera (114).
    [3]
    3. The method according to the preceding claim, wherein the camera in the coordinate system of the placement machine (100) movable camera (i 14).
    [4]
    4. The method according to any one of the preceding claims, wherein i the mark (132 232a) is detected together with a structural element of the placement machine (100) having a fixed spatial position in the coordinate system of the placement machine (100).
    [5]
    A method according to any one of the preceding claims, further comprising detecting the mark (132, 232a) again; re-determining the position of the re-detected mark (132 232a) in the coordinate system; and loading the component carrier (130) with a third plurality of components, taking into account the again determined position.
    [6]
    A method according to any one of the preceding claims, further comprising detecting at least one further mark (232b, 232c, 232d) attached to the component carrier (130); Determining the position of the detected further mark (232b, 232c, 232d) in the coordinate system, wherein, when the component carrier (130) is loaded with the first plurality of components (290), the determined position of the detected further mark (232b, 232c, 232d) is taken into account; % again detecting the further mark (232b, 232c, 232d); and again determining the position of the re-detected further mark (232b, 232c, 232d) in the coordinate system, wherein when re-assembling the component carrier (130) with the second plurality of components, the re-determined position of the detected further mark (232b, 232c, 232d ) is taken into account.
    [7]
    7. Method according to the preceding claim, wherein the marking (232a) is assigned to a first subregion (235) of the component carrier (130) and the further marking (232c) is assigned to a second subregion of the component carrier (130), wherein the first subregion ( 235) is different from the second sub-area.
    [8]
    8. The method of claim 1, further comprising monitoring a measure indicative of an operating condition for the process of populating the device carrier with the first plurality of devices; wherein re-detecting the mark (132, 232a) and redetermining the position of the re-detected mark (132, 232a) in the coordinate system is performed when the current value of the monitored measure has exceeded a predetermined threshold.
    [9]
    9. The method according to the preceding claim 8, wherein the monitored measurand is a current time between a start time and a current time, the start time being predetermined by the flow of the process up to loading the device carrier (130) with the first plurality of Devices (290) and wherein the predetermined threshold is a predetermined period of time.
    [10]
    A method according to the preceding claim 9, wherein the start time is determined by detecting the mark.
    [11]
    11. The method according to any one of the preceding claims 8 to 10, wherein the monitored measured variable is the temperature present in the placement area (108).
    [12]
    The method according to the preceding claim 11, wherein the threshold value is a predetermined temperature or a predetermined temperature change which has been set since the detection of the mark (132, 232a).
    [13]
    13. The method according to any one of the preceding claims 8 to 12, wherein the monitored measured variable is an amount of heat which is discharged into and / or to the placement area (108) of components of the placement machine (100) and in particular of electromechanical components of the placement machine (100) ,
    [14]
    A method according to any one of the preceding claims 8 to 12, wherein the monitored measurand is the number of devices (290) placed on the device carrier (130) since previously determining the position of the marker (132, 232a).
    [15]
    15. placement machine for equipping a component carrier (130) with electronic components, the placement machine (100) comprising a placement region (108) for receiving the component carrier (130); a camera (114) for measuring at least one marker (132, 232a) attached to the component carrier (130); a placement head (107) (i) for receiving at least one electronic component (290), (ii) for transporting the at least one received electronic component (290) over the component carrier (130) and (iii) for mounting the at least one transported electronic component (290) on the component carrier (130); and a data processing device coupled to the camera (114), wherein the data processing device (101, 118) is arranged to cause the placement machine (100) to carry out the method according to one of the preceding claims.
    [16]
    A computer program for populating a component carrier (130) with electronic components (290) adapted to perform the method of any one of claims 1 to 14 when executed by a data processing device (101, 118).
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    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    DE102015106224.0A|DE102015106224A1|2015-04-22|2015-04-22|Repeated measuring of a component carrier located in a placement area of a placement machine|
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